Bonding process of dissimilar materials (SUS and Cu)
Design is free, and we can accommodate your requests for tape! It is possible to bond different materials with insulating adhesive.
We assist with the application of back tape for lead frames as a primary example of our adhesive processing. In general adhesive processing, the bonding of the same material is common, but by incorporating a polyimide adhesive layer, it is possible to bond dissimilar materials with heat resistance. We also offer suggestions for materials tailored to your specific applications. Additionally, we will check the availability of various tapes, PI films, Teflon sheets, etc., so please feel free to consult with us. 【Benefits of Adhesive Processing】 ■ It is possible to bond dissimilar materials with their respective characteristics: - SUS430 material → imparts magnetism - Cu material → conductivity and heat dissipation - Ti material → corrosion resistance - Ni alloy material → thermal expansion coefficient similar to glass, etc. *For more details, please refer to the related links or feel free to contact us.
- Company：平井精密工業
- Price：Other
